Samsung 3.0-megapixel (M-pixel) CMOS for Camera phones

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Samsung announced the first 3.0-megapixel (M-pixel) CMOS image sensor with a 1/4-inch lens aperture that is well suited for ultra slim camera phones. The new 1.75um-size pixel enables the 1/4-inch lens aperture to drastically reduce the camera module size by 30 percent as opposed to a conventional 2.25um pixel 1/3-inch lens aperture 3M-pixel CIS. The small form factor allows the 1.75um-pixel, 1/4-inch lens aperture 3M-pixel CIS to immediately replace a 1/4-inch lens aperture 2M-pixel CIS module, as it shares the same physical measurements with the new 3M-pixel CIS.

The 1.75um pixel, 1/4-inch lens aperture 3M-pixel CIS shows no degrading in the picture quality compared to a 2.25um pixel, 1/3-inch lens aperture 3M-pixel CIS. The new CIS chip provides a small form factor and high picture quality.

By utilizing 90-nanometer (nm) process technology, Samsung expects to mass produce the new 1.75um pixel, 1/4-inch lens aperture 3-Mp CIS in the first quarter of 2007. The new CIS chip uses Samsung's proprietary 90nm copper technology that reduces the distance between the micro-lens to the photo diode thereby resulting in maximizing the light-gathering efficiency to overcome the potential decline of image quality as the pixel size scales down.

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